Vision based Microassembly of 3D Solid and Complex MEMS
Contributors: B. Tamadatze, E. Marchand, S. Dembele, N. Le Fort-Plat
The video shows an automatic assembly of fives silicon microparts of 400 µm x 400 µm x 100 µm on 3-levels. Each microassembly subtask is performed using a pose-based visual control which uses a CAD model-based tracker. The assembly clearance is estimated to 3 µm that allows to obtain solid and complex micro electro-mechanical structures without any external joining (glue, wending).